- Excellent Thermal Conductivity.
Louver design helps the airflow movement into an “U-shape” aluminum fin to increase the path of thermal conductivity.
- Exceptional Heat Transfer Efficiency.
Louver fin breaks the thermal boundary layer to increase heat exchange rate.
H.D.T. (Heatpipe Direct Touch) Technology ensures rapid thermal conduction and eliminates CPU hot spot.
Slim heat sink tower design increases RAM installation flexibility.
S.N.T.C (Super Nano Thermal Conductive) coating protects heat sink to avoid oxidation, keeps excellent heat transfer efficiency and extends the life expectancy of the cooler.
Intelligent APS (Adjustable Peak Speed) control of the cooling fan directly provides 3 peak RPM selections for user preferences.
Barometric Oilless (BOL) Bearing for long life span and silent spinning.
Black or White colors are available.
- Silence with High Performance.
Sophisticated fin gap calculation leads the ultra balancing between fan speed and heat transfer efficiency.
All-in-one bracket for both latest Intel® and AMD® sockets.
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Louver fin creates an “U-shape” airflow and force the air to take more heat than standard fin. |
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RAM compatibility
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H.D.T. Technology (Patented)
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APS control (Patented)
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Model Name |
LPALV12 |
Compatible Socket |
Intel® LGA 775/1150/1151/1155/1156/1366/2011 and AMD®AM2/AM2+/AM3/AM3+/FM1/FM2/FM2+ |
Dimension |
138(L) × 85(W) × 160(H) mm |
Heat Sink Dimension |
138(L) × 60(W) × 160(H) mm |
Heat Sink Weight |
460 g |
Heat Pipe |
4 x Ø6 mm |
Heat Sink Material |
Copper Heat Pipes/Aluminum Fins/S.N.T.C. coating |
Thermal Resistance |
0.095 °C/W |
Thermal Grease |
Dow Corning® TC-5121 |
Fan Dimension |
120 x 120 x 25 mm |
Fan Speed |
800~1500/1800/2200 rpm |
Fan Air Flow |
40.7 ~ 76.6/91.6/112 CFM
69.2 ~ 130.2/174.4/213.1 m3/h |
Fan Static Pressure |
0.83 ~ 1.8/2.43/3.64 mmH2O |
Fan MTBF |
≧160,000 hrs |
Fan Noise |
8 ~ 17/20/23 dBA |
Fan Bearing Type |
BOL Bearing |
Fan Connector |
4 pin PWM |